ASSEMBLY CAPABILITIES
From Prototype Through Production
PCB assembly is where component selection, solder paste deposition, placement accuracy, reflow control and inspection all come together. As component density increases and packages become smaller, maintaining control across each of these stages becomes increasingly important to assembly quality and yield.
PCB Runner supports SMT, through-hole and mixed-technology PCB assembly for prototypes, low-volume builds and production requirements. From fine-pitch components and BGAs to mixed-technology assemblies, each build is reviewed against the BOM, placement data and assembly documentation before production begins to identify potential issues early.
Whether you are validating a new design or moving an established product into production, our assembly capabilities provide the engineering support, process control and inspection needed throughout the build.
Capability Chart
| Capability | Specification |
|---|---|
| Assembly Types | SMT, through-hole, mixed technology |
| Component Package Range | 0201 to large BGA and QFN |
| Placement Accuracy | ±0.05mm |
| Placement Speed | Up to 30,000 CPH per line |
| Board Sizes Supported | 20mm x 20mm up to 500mm x 400mm |
| BGA and Fine-Pitch Support | Yes, with X-ray verification |
| Conformal Coating | Available on request |
| Testing Options | AOI, X-ray, ICT, flying probe, functional test |
| Turnaround | Same-day quote, prototype builds in as little as 24 hours |
PCB Assembly Capabilities Offered by PCB Runner
Assembly is where a design either comes together the way it was intended or reveals problems nobody caught on paper. Our process is built to catch those problems before they leave the line.
SMT Assembly
Most modern boards run through surface mount technology, and ours is no different. We place components as small as 0201 packages with placement accuracy that holds up across long production runs, not just on the first few boards off the line.
Through-Hole Assembly
Some components, especially connectors and higher-power parts, still need through-hole mounting. We run automated and hand insertion depending on the part and the volume, and we do not treat this as a lesser process just because it is older technology.
Mixed Technology Assembly
Plenty of boards need both SMT and through-hole components on the same assembly. We sequence these builds so the board only goes through reflow and wave soldering once each, which keeps thermal stress on the components to a minimum.
Fine-Pitch and BGA Placement
Ball grid arrays and fine-pitch components hide their solder joints under the package, which makes placement accuracy and post-placement verification critical. We place these with X-ray confirmation, not a visual check that cannot actually see the joint.
Prototype Assembly
New designs need fast turnaround without losing the inspection steps that catch a bad footprint or a mislabeled part. We run prototype builds in as little as 24 hours while keeping AOI and testing in place.
Production Assembly
Once a design is validated, we scale into production runs without changing the process that got the prototype right in the first place. The same inspection steps apply whether we are building ten boards or ten thousand.
Conformal Coating and Protective Finishing
Boards headed into harsh environments, whether that is moisture, vibration, or temperature swings, can be coated after assembly to protect the components and extend the life of the board.
Component Sourcing Support
We can source components directly or work from a kit you provide, and either way we check parts against the BOM before they go anywhere near the line.
Why Choose PCB Runner for Assembly Capabilities
A board that looks right on the shop floor is not the same as a board that works right in the field. The difference usually comes down to how the assembly process is run.
Fabrication and Assembly Under One Roof
Engineering Review Before Assembly Starts
Fine-Pitch Experience
Fast Prototype Turnaround
Scalable Without Starting Over
- cation and Assembly Under One Roof: Since we build the board and assemble it in the same facility, there is no shipping gap between fabrication and assembly where a board could get damaged or delayed.
- Engineering Review Before Assembly Starts: Files, BOMs, and pick-and-place data all get checked before parts are pulled for a job. A mismatch caught here costs nothing. A mismatch caught mid-run costs a rework cycle.
- Fine-Pitch Experience: Placing a 0201 resistor or a fine-pitch BGA correctly takes more than a machine that can technically handle the part size. It takes a process tuned to catch the small errors that a coarser process would miss entirely.
- Fast Prototype Turnaround: A 24-hour prototype build does not mean skipping steps. It means running the same process faster because the batch is smaller, not because the inspection gets cut.
- Scalable Without Starting Over: Moving from a validated prototype into production does not mean re-qualifying the process from scratch. The line, the inspection steps, and the documentation carry forward.
Quality & Inspection
Assembly defects are often smaller and harder to catch than fabrication defects, since a lot of what goes wrong happens underneath a component rather than on the surface. That is why inspection at this stage has to be layered, not left to a single check at the end.
Automated Optical Inspection (AOI)
Every assembled board is scanned for missing components, misalignment, and solder defects before it moves further down the line.
X-Ray Inspection
BGA and QFN solder joints are hidden under the package once placed. X-ray lets us verify those joints instead of assuming the placement machine got it right.
In-Circuit Testing (ICT)
In-Circuit Testing (ICT): Where applicable, boards are tested against expected electrical values to catch shorts, opens, and incorrect component values before the board ships.
Functional Testing
For assemblies where it matters, we can run functional tests that confirm the board actually performs its intended job, not just that it is electrically sound.
Flying Probe Testing
For lower volume or prototype runs where a bed-of-nails fixture is not practical, flying probe testing gives us the same net-level confidence without the tooling cost.
IPC-A-610 Compliance
Our assembly workmanship is held to IPC-A-610 standards, with Class 3 available for boards headed into applications where a defect is not an acceptable outcome.
Industries We Support
Assembly requirements shift a lot depending on where the board ends up. Here is where our assembly capabilities get used most often.
Telecommunications
High-density boards with fine-pitch components
Aerospace and Defense
Class 3 workmanship, conformal coating
Medical Devices
Traceable component sourcing, functional testing
Automotive
Thermal cycling resistance, high reliability soldering
Industrial Automation
Mixed technology assemblies, durable finishes
Consumer Electronics
Fast turnaround, compact component placement
A medical board and an automotive board can look similar on paper but need very different assembly considerations once you factor in how and where they will actually be used. We adjust the process to the application rather than running every job the same way.
Frequently Asked Questions
PCB assembly is the process of placing and soldering components onto a fabricated board, then testing it to confirm the components are placed correctly and the board functions as designed.
SMT mounts components directly onto the surface of the board, while through-hole assembly places component leads through drilled holes and solders them on the opposite side. Many boards use both.
 Yes. Prototype builds can be turned around in as little as 24 hours, and production runs use the same process and inspection steps once a design is validated.
Our lines place components as small as 0201 packages, along with fine-pitch and BGA parts that require X-ray verification after placement.
Either works. We can source components directly against your BOM, or assemble from a kit you provide after checking the parts against the BOM first.
We use automated optical inspection, X-ray, in-circuit testing, flying probe testing, and functional testing depending on the board and the application.
Yes. Conformal coating can be applied after assembly for boards facing moisture, vibration, or temperature extremes.
A bill of materials, Gerber or ODB++ files, a pick-and-place file, and your assembly drawing let us put together an accurate quote without extra rounds of questions.
Ready to Get Your Board Assembled Right?
A well-designed board can still fail if the assembly process cuts corners on placement accuracy or inspection. At PCB Runner, every job goes through the same engineering review and layered inspection, whether it is a five-board prototype run or a full production order.
Send us your files and BOM, and we will walk through the assembly plan with you before parts ever get pulled for the line.
