Flex Capabilities

For a cost-effective and reliable flex circuit design, pay special attention to Flex Capabilities. Such capabilities include:  material selection, process tolerances, manufacturing logistics, and the flex supplier, as each of them play important roles.

For exceptional Flex Capabilities, We at PCB Runner assist you with DFM or Design for Manufacturing. It can minimize the overall program costs.

Flex Capabilities

Our design team can help when your design requires tighter tolerances or special process treatments — just talk to us.

Material Selection
Polyimide (Thickness)12 µm (0.0005”), 25 µm (0.001”), 50 µm (0.002”), 75 µm (0.003”), 15 µm (0.005”)
Copper (Thickness)9 µm (0.25 oz), 12 µm (0.33 oz), 17 µm (0.5 oz), 35 µm (1 oz), 70 µm (2 oz)
Copper Foils (Rolled-Annealed)Polyester, Polyimide, PIC (Photo Imageable Cover Coat), LPI (Liquid Photo Imageable)
StiffenersPhenolic Butyral, Acrylic, Customer Supplied
Thermo-Bond AdhesivesPhenolic Butyral, Acrylic, Modified Epoxy
Surface FinishesImmersion Tin, Entek 106A, ENIG (Electroless Nickel Immersion Gold), Hard Gold, Electrolytic Soft Bondable Gold, Tin/Lead Plating, and Hot Air Solder Leveling

 

Process Capabilities and Tolerances
Minimum Trace/Space0.0015”/0.002” for 0.33 oz copper

0.002”/0.0025” for 0.5 oz copper

0.003”/0.0035” for 1 oz copper

Minimum Via Hole Dia (Before Plating)0.006” (NC Drill)

0.002” (UV Laser)

Minimum Blind Via Dia (Before Plating)0.004” (UV Laser)
Trace to Edge Distance0.010” for NC Routing

0.008” for Die Punch method

0.001” for UV Laser

Trace to Edge Tolerance0.005” for NC Routing

0.003” for Die Punch method

0.001” for UV Laser

Cover Layer Aperture Positional Tolerance0.005” for Cover Film

0.002” for LPI and PIC

0.001” for Laser Ablation