| Finish Type | Description |
| Hot Air Solder Leveled (HASL) | Solder deposit on features not covered with solder mask. Solder used – 63/37 % eutectic Tin/Lead. Solder thickness 0.2-1.2 mils, variation due to change in board circuit density. |
| Organic Solderability Preservative (OSP) | A transparent organic coating on features not covered with solder mask. |
| Electroless Nickel Immersion Gold (ENIG) | Electroless Nickel and Immersion Gold coating on features not covered with solder mask. |
| Gold Flash | Electrolytic Nickel and Gold deposit on features not covered with solder mask. Typical Nickel thickness 0.15-0.2 mils. Typical gold thickness 0.005-0.010 mils. Gold flash requires Copper plating on pattern. |
| Immersion Silver (IAg) | Immersion Silver deposit on features not covered with solder mask. Typical Silver thickness 0.004-0.020 mils. |
| White Tin | Immersion Tin deposit on features not covered with solder mask. Typical Tin thickness 0.030-0.040 mils. |
| Carbon Ink — Key Pad Applications | Conductive Carbon paste on selective pads for making contact — Remote keypads etc. |
| Wire Bondable Soft Gold | Electrolytic soft Gold plating on features requiring bondable Gold for wire bonding. Typical Gold thickness 0.020-0.050 mils, depending on type of wire bonding used. Typical Nickel thickness between 0.15-0.25 mils. |
