Technologies

Items Standard Advanced
Minimum Line/Spacing (Internal) 3/3 3/3
Minimum Line/Spacing (External) 4/4 3/3
Drilled Hole Size, Minimum 8 6
Aspect Ratio (Thickness to Drill Dia) 10:1 15:1
Annular Ring (Diameter over Drill Dia) 10 8
Anti-pad (Diameter over Drill Dia) 20 16
Plated Hole Tolerance ±3 ±2
Minimum Dielectric Thickness 3 2
Maximum PCB Thickness (inches) 0.200 0.250
Thickness Tolerance (% of Thickness) ±10 ±7
Maximum PCB Dimensions (inches) 16.0 X 22.0 30.0 X 44.0
Fabricated Dimensions – NC Routing ±5 mils ±3 mils
Layer-to-Layer Registration Tolerance ±5 ±3
Solder Mask Clearance, each Side 2.0 mils 1.5 mils
Blind/Buried Vias (All Types) Yes Yes
Via Fill (Conductive, Non-Conductive) No Yes

 

Inner-Layers Standard Advanced
Minimum Core thickness 3 mils 2 mils
Minimum Line width 4 mils 3 mils (H Oz copper)
Minimum Spacing (Air gap) 4 mils 3 mils (H Oz copper)
Minimum pad size Drill size+10 mils Drill Size+7 mils
Minimum Anti Pad (planes) Drill Size+20 mils Drill Size+16 mils

 

Outer Layers Standard Advanced
Max. Finished Thickness 0.200 0.250
Thickness Tolerance ±10% ±5%
Max. Aspect Ratio 10:1 12:1
Min. Drill Size 10 8 mils
Min. Line width 4 mils 3 mils
Min. Spacing (air gap) 4 mils 3 mils
Min. Solder mask clearance 4 mils 3 mils
Min. solder mask web thickness (mask between pads) 4 mils 3.4 mils