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    Manufacturing Capabilities – Technology of PCB RUNNER
      Standard Advanced Emerging
    Layer Count 2-48 Layers 2-48 Layers 50+ Layers
    Laminate Materials      
    FR4 Tg 140 Yes Yes Yes
    FR4 Tg 170 Yes Yes Yes
    FR4 Tg 180 Yes Yes Yes
    GETEK Yes Yes Yes
    Polyimide Yes Yes Yes
    Rogers RF Yes Yes Yes
    TaconicRF Yes Yes Yes
    Arlon RF Yes Yes Yes
    Duriod Yes Yes Yes
    RoHS Materials Yes Yes Yes
    Halogen Free Yes Yes Yes
    Aluminum Backing Yes Yes Yes
    Brass Backing Yes Yes Yes
    Copper Backing Yes Yes Yes
    Bergquist Yes Yes Yes
    Laird Yes Yes Yes
    C-LECPlastic Yes Yes Yes
    Speed Board Yes Yes Yes
    Flex Substrates Yes Yes Yes
    Board Types      
    Rigid yes yes yes
    Rigid-Flex yes yes yes
    Flex yes yes yes
    RF Microwave yes yes yes
    Mix Dielectrics / Hybrid Material yes yes yes
    Dielectrics With Metal Core/Backing yes yes yes
    Panel Sizes Standard Panel Non-Standard Panel  
    12 X 18 Yes No  
    16 X 18 Yes No  
    16 x 21 No Yes  
    18 X 24 Yes No  
    21 x 24 No Yes  
    22 x 28 No Yes  
    47″ x 47″ (maximum working panel 2 layers) No Yes  
    39″ x 39″ (maximum working panel 4-8 layers) No Yes  
    27″ x 27″ (maximum working panel 10 layers) No Yes  
    ** Panel Utilization CanVary On Panel Area Depending On Design, IPC Coupons & TDR Coupons.
    Board Types      
    Finish Thickness .003″ to .200″ .003″ to .500″ > .500
    Minimum Core Thickness .004″ .003″ .002″
    Finished Thickness Tolerance 10% 7% 5%
    Multiple Lamination Cycles 5 7 7+
    Copper Foil Weights (Internal Layers) 1/2 – 3 OZ 1/4 – 4 OZ 1/4 – 6 OZ
    Copper Foil Weights (External Layers) 1/2 – 3 OZ 1/4 – 4 OZ 1/4 – 6 OZ
    Pad, Lines & Spacing Diameters      
    External LineWidth .004″ .003″ .002″
    External Spacing .004″ .003″ .002″
    Internal LineWidth .004″ .003″ .002″
    Internal Spacing .004″ .003″ .002″
    External PadSize – Annual Ring Per Side .005″ .004″ .003″
    Internal PadSize – Annular Ring Per Side .005″ .004″ .003″
    SMT Pitch .040″ .030″ .020″
    BGA Pitch .040″ .030″ .020″
    Impedance 10% 5% 2.5%
    Plating Finishes      
    ENIG (Electroless NickelImmersion Gold) Yes Yes Yes
    Immersion Silver Yes Yes Yes
    Immersion White Tin Yes Yes Yes
    HASL (60/40 Tin-Lead) Yes Yes Yes
    HAL (Lead-Free) Yes Yes Yes
    Nickel(Electroplated) Yes Yes Yes
    Palladium (Electroplated) Yes Yes Yes
    Gold (Electroplated) Yes Yes Yes
    Soft Wire Bondable Gold Yes Yes Yes
    OSP (Organic Surface Protection) Yes Yes Yes
    Carbon Ink Yes Yes Yes
    Selective Plating Yes Yes Yes
    RoHSFinishes      
    ENIG (Electroless NickelImmersion Gold) Yes Yes Yes
    Immersion Silver Yes Yes Yes
    Immersion White Tin Yes Yes Yes
    HAL (Lead-Free) Yes Yes Yes
    OSP (Organic Surface Protection) Yes Yes Yes
    Soft Wire Bondable Gold Yes Yes Yes
    Tolerances      
    Hole Aspect Ratio 10:1 15:1 20:1
    Drilled Hole To Copper .008″ .005″ < .005"
    Plated Hole Tolerances (+/-) .003″ .002″ <.002"
    Non Plated Hole Tolerances (+/-) .001″ .001″ .001″
    Fabrication Tolerances (+/-) .005″ .003″ <.003"
    Board thickness Tolerance(+/-) 10%
    Via Holes      
    Laser Micro Vias 0.004 * 0.003 * 0.002 *
    BlindVias .0063″ .0063″ .0063″
    Buried Vias .0063″ .0063″ .0063″
    Via HolesUnder PAD Yes Yes Yes
    Laser Drill Pending Pending Pending
    Mechanical Drill Vias .0063″ .0063″ .0063″
    Tented Vias Coated with LPI Coated/Plugged Coated/Plugged
    Silver Conductive Via Filled Yes Yes Yes
    Copper Conductive Via Filled Yes Yes Yes
    Non-Conductive Via Filled Yes Yes Yes
    Copper Plated Plugged Vias (80%) .008″ Min Yes Yes Yes
    Automated Planarization Capability Yes Yes Yes
    Automated Planarization Capability * Laser Drilling outsourced
    Routing/Scoring      
    Scoring (Jump) Yes Yes Yes
    Scoring (Jump) Min length 1″ Yes Yes Yes
    Scoring Webb .014 +/- .003 Min Yes Yes Yes
    Routed/Plated Edges Yes Yes Yes
    Routed/Plated Pockets & Cuts Outs Yes Yes Yes
    Z-Depth Routing (Plated Pockets & Cutouts) Yes Yes Yes
    Cavities (Plated & Non-Plated) Yes Yes Yes
    Soldermask      
    LPI(Liquid Photo Imagable Soldermask) Yes Yes Yes
    Soldermask Colors All Avail.Colors All Avail.Colors All Avail.Colors
    Soldermask Type LPI LPI LPI
    Dry FilmSoldermask Yes Yes Yes
    Minimum Mask Clearance (LPI)Per Side .003″ .002″ .001″
    Minimum Mask Clearance (Dry Film) .003″ .003″ .003″
    Minimum Soldermask Thickness (LPI) .0005″ .0004″ .0004″
    Minimum Soldermask Thickness (Dry Film) .003″ .003″ .003″
    Soldermask Web Minimum (LPI) .004″ .003″ .003″
    Soldermask Web Minimum (Dry Film) .010″ .008″ .008″
    Silkscreen/Legend      
    Silkscreen/Legend Colors All Avail.Colors All Avail.Colors All Avail.Colors
    Silkscreen/Legend Feature Size .008″ W X .030 H Min. .008″ W X .030 H Min. .008″ W X .030 H Min.
    Flatness IPSStandard IPC Standard IPC Standard
    Electrical Testing      
    Netlist Testing Yes Yes Yes
    Flying Probe Yes Yes Yes
    Clamshell Fixture Yes Yes Yes
    Netlist IPC-356A Yes Yes Yes
    Controlled Impedance      
    Controlled Impedance Testing Yes Yes Yes
    TDR Tester (Polar Instruments) Yes Yes Yes
    Impedance tolerance (+/-) 10% 5% 2.50%
    CAM      
    Genesis 2000 Yes Yes Yes
    ODB++ Yes Yes Yes
    FTPSite Yes Yes Yes
    Certifications & Standards      
    AS9100Certified Yes Yes Yes
    ISO 9001:2008 Certified Yes Yes Yes
    MIL-PRF-31032 Certified Pending late 2011 Pending late 2011 Pendind late 2011
    ITAR Registered Yes Yes Yes
    IPC Standards Yes Yes Yes
    IPC-6012 Class 1,2,& 3 Yes Yes Yes
    IPC-6013 Class 1,2,& 3 Yes Yes Yes
    IPC-6018 Class 1,2 & 3 Yes Yes Yes
    MIL-PRF-55110 Certified FR4/GFN Yes Yes Yes
    MIL-PRF-55110 Certified Polyimide/GIN Yes Yes Yes
    Certified Etchback On Mil-PRF-55110 Yes Yes Yes