Manufacturing Capabilities – Technology

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    Manufacturing Capabilities – Technology of PCB RUNNER
     StandardAdvancedEmerging
    Layer Count2-48 Layers2-48 Layers50+ Layers
    Laminate Materials   
    FR4 Tg 140YesYesYes
    FR4 Tg 170YesYesYes
    FR4 Tg 180YesYesYes
    GETEKYesYesYes
    PolyimideYesYesYes
    Rogers RFYesYesYes
    TaconicRFYesYesYes
    Arlon RFYesYesYes
    DuriodYesYesYes
    RoHS MaterialsYesYesYes
    Halogen FreeYesYesYes
    Aluminum BackingYesYesYes
    Brass BackingYesYesYes
    Copper BackingYesYesYes
    BergquistYesYesYes
    LairdYesYesYes
    C-LECPlasticYesYesYes
    Speed BoardYesYesYes
    Flex SubstratesYesYesYes
    Board Types   
    Rigidyesyesyes
    Rigid-Flexyesyesyes
    Flexyesyesyes
    RF Microwaveyesyesyes
    Mix Dielectrics / Hybrid Materialyesyesyes
    Dielectrics With Metal Core/Backingyesyesyes
    Panel SizesStandard PanelNon-Standard Panel 
    12 X 18YesNo 
    16 X 18YesNo 
    16 x 21NoYes 
    18 X 24YesNo 
    21 x 24NoYes 
    22 x 28NoYes 
    47″ x 47″ (maximum working panel 2 layers)NoYes 
    39″ x 39″ (maximum working panel 4-8 layers)NoYes 
    27″ x 27″ (maximum working panel 10 layers)NoYes 
    ** Panel Utilization CanVary On Panel Area Depending On Design, IPC Coupons & TDR Coupons.
    Board Types   
    Finish Thickness.003″ to .200″.003″ to .500″> .500
    Minimum Core Thickness.004″.003″.002″
    Finished Thickness Tolerance10%7%5%
    Multiple Lamination Cycles577+
    Copper Foil Weights (Internal Layers)1/2 – 3 OZ1/4 – 4 OZ1/4 – 6 OZ
    Copper Foil Weights (External Layers)1/2 – 3 OZ1/4 – 4 OZ1/4 – 6 OZ
    Pad, Lines & Spacing Diameters   
    External LineWidth.004″.003″.002″
    External Spacing.004″.003″.002″
    Internal LineWidth.004″.003″.002″
    Internal Spacing.004″.003″.002″
    External PadSize – Annual Ring Per Side.005″.004″.003″
    Internal PadSize – Annular Ring Per Side.005″.004″.003″
    SMT Pitch.040″.030″.020″
    BGA Pitch.040″.030″.020″
    Impedance10%5%2.5%
    Plating Finishes   
    ENIG (Electroless NickelImmersion Gold)YesYesYes
    Immersion SilverYesYesYes
    Immersion White TinYesYesYes
    HASL (60/40 Tin-Lead)YesYesYes
    HAL (Lead-Free)YesYesYes
    Nickel(Electroplated)YesYesYes
    Palladium (Electroplated)YesYesYes
    Gold (Electroplated)YesYesYes
    Soft Wire Bondable GoldYesYesYes
    OSP (Organic Surface Protection)YesYesYes
    Carbon InkYesYesYes
    Selective PlatingYesYesYes
    RoHSFinishes   
    ENIG (Electroless NickelImmersion Gold)YesYesYes
    Immersion SilverYesYesYes
    Immersion White TinYesYesYes
    HAL (Lead-Free)YesYesYes
    OSP (Organic Surface Protection)YesYesYes
    Soft Wire Bondable GoldYesYesYes
    Tolerances   
    Hole Aspect Ratio10:115:120:1
    Drilled Hole To Copper.008″.005″< .005"
    Plated Hole Tolerances (+/-).003″.002″<.002"
    Non Plated Hole Tolerances (+/-).001″.001″.001″
    Fabrication Tolerances (+/-).005″.003″<.003"
    Board thickness Tolerance(+/-)10%
    Via Holes   
    Laser Micro Vias0.004 *0.003 *0.002 *
    BlindVias.0063″.0063″.0063″
    Buried Vias.0063″.0063″.0063″
    Via HolesUnder PADYesYesYes
    Laser DrillPendingPendingPending
    Mechanical Drill Vias.0063″.0063″.0063″
    Tented ViasCoated with LPICoated/PluggedCoated/Plugged
    Silver Conductive Via FilledYesYesYes
    Copper Conductive Via FilledYesYesYes
    Non-Conductive Via FilledYesYesYes
    Copper Plated Plugged Vias (80%) .008″ MinYesYesYes
    Automated Planarization CapabilityYesYesYes
    Automated Planarization Capability* Laser Drilling outsourced
    Routing/Scoring   
    Scoring (Jump)YesYesYes
    Scoring (Jump) Min length 1″YesYesYes
    Scoring Webb .014 +/- .003 MinYesYesYes
    Routed/Plated EdgesYesYesYes
    Routed/Plated Pockets & Cuts OutsYesYesYes
    Z-Depth Routing (Plated Pockets & Cutouts)YesYesYes
    Cavities (Plated & Non-Plated)YesYesYes
    Soldermask   
    LPI(Liquid Photo Imagable Soldermask)YesYesYes
    Soldermask ColorsAll Avail.ColorsAll Avail.ColorsAll Avail.Colors
    Soldermask TypeLPILPILPI
    Dry FilmSoldermaskYesYesYes
    Minimum Mask Clearance (LPI)Per Side.003″.002″.001″
    Minimum Mask Clearance (Dry Film).003″.003″.003″
    Minimum Soldermask Thickness (LPI).0005″.0004″.0004″
    Minimum Soldermask Thickness (Dry Film).003″.003″.003″
    Soldermask Web Minimum (LPI).004″.003″.003″
    Soldermask Web Minimum (Dry Film).010″.008″.008″
    Silkscreen/Legend   
    Silkscreen/Legend ColorsAll Avail.ColorsAll Avail.ColorsAll Avail.Colors
    Silkscreen/Legend Feature Size.008″ W X .030 H Min..008″ W X .030 H Min..008″ W X .030 H Min.
    FlatnessIPSStandardIPC StandardIPC Standard
    Electrical Testing   
    Netlist TestingYesYesYes
    Flying ProbeYesYesYes
    Clamshell FixtureYesYesYes
    Netlist IPC-356AYesYesYes
    Controlled Impedance   
    Controlled Impedance TestingYesYesYes
    TDR Tester (Polar Instruments)YesYesYes
    Impedance tolerance (+/-)10%5%2.50%
    CAM   
    Genesis 2000YesYesYes
    ODB++YesYesYes
    FTPSiteYesYesYes
    Certifications & Standards   
    AS9100CertifiedYesYesYes
    ISO 9001:2008 CertifiedYesYesYes
    MIL-PRF-31032 CertifiedPending late 2011Pending late 2011Pendind late 2011
    ITAR RegisteredYesYesYes
    IPC StandardsYesYesYes
    IPC-6012 Class 1,2,& 3YesYesYes
    IPC-6013 Class 1,2,& 3YesYesYes
    IPC-6018 Class 1,2 & 3YesYesYes
    MIL-PRF-55110 Certified FR4/GFNYesYesYes
    MIL-PRF-55110 Certified Polyimide/GINYesYesYes
    Certified Etchback On Mil-PRF-55110YesYesYes