High Density Interconnection In Hole
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HDI Technology in Hole


High Density Interconnection












Blind & Burried 9+2+9 Laser Drill


Market Trend vs. Technology Solution


HDI Process Flow


Main Process of Build – up Layer


Construction Materials
Material Type
FR 4 Tetra Function ( Tg. 130 – 140 ℃ ) FR 4 High Tg ( Tg. 160 – 180 ℃ ) RCC ( Tg. 150 ℃ & Tg. 185 ℃ ) Ink ( VIL )
Comparison of Material
Prepreg | RCC | |
---|---|---|
Low Cost | ++ | – |
Strength | ++ | + |
Hole wall roughness | – | + |
Laminating control | + | – |
Dielectric thickness | 45um ~ | 30um ~ 80um |
Smear residue on target pad | – | ++ |
Dielectric constant | 3.9 ~ 4.7 | 3.2 ~ 3.8 |
Shelf time | ++ | + |
Working PNL size | ++ | + |
Comparison of Via Technologies
Mechanical Drilling | Laser Drilling | |
---|---|---|
Low Cost in Equipment | ++ | + |
Low Cost in Production | + | ++ |
Required Facilities | Drilling Machine | Laser Machine |
Consumable | Drill Bits, Backup Board | None |
Aspect Ratio | 9 | 1 |
Via Size Capacity | 200 um~ | 50~100um |
Speed | 140 H/min | 20,000 H/min |
Throughput | – | + |
Comparison of Blind Via
Prepreg


RCC


Build-up for 2 + N + 2
Through Hole
Inner Laser Via
Stack Hole
Inner Via Hole
Surface Laser Via


Laser Via Quality


1+6+1 without buried, extend to 1+N+1


1+4+4+1 with buried via, extend to 1+N+N+1


2+4+2 laser via on laser via


2+4+2 Staggered via, extend to 2+N+2


Blind via Capability


4- Layer Core Receiving


I.V.H.(Inner Via Hole) Drilling


Electroless Copper Plating


Electro Plating


Inner Via Hole Plugging
( for thickness >= 60 mil )


I.V.H.Grinding
( for thickness >= 60 mil )


Dry Film Lamination


D.F. Exposure / Developing


Etching


D.F. Strip


Black Oxide Treatment


Prepreg Layup


Lamination


Dry Film Lamination


D.F. Exposure / Developing


Etching


D.F. Strip


Mechanical Drlling for TH


Laser Drlling for Blind Via


Desmear / Electroless Copper Plating


Electro Plating


Dry film, Exposure & DES


Solder Mask Printing


S/M Exposure / Developing


Surface Finish


Symbol Mask Printing


Inspection

