Flex and Rigid Hybrid Board

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    Flex + Rigid Hybrid Board

    Flex + Rigid Hybrid Board

    Flex and Rigid Hybrid Board

    Flexible Board

    Polyimide kapton

    FLEX_RIGID-FLEX

    Blind & Burried 1+FLEX+1 Laser drill

    FLEX_RIGID-FLEX
    FLEX_RIGID-FLEX
    • Material:
    • Flex:L2~L3 TU-768:L1~L0 L0~L4
    • Laser:L4~L0 laser via:0.006″
    • dielec tricthickness: 0.0035″~0.0045″
    • No VIPPO

    Construction Materials

    Material Type

    • PI thic:1~3mils
    • Coverlay thic:2mils Ink thic:0.5~0.9mils
    • Adhesive thic:1~2mils (Polyester)
    • Nonflow PP 47N 49N thic:2.5mils
    • Stiffener PI FR4 AL
    • Copper ED RA
    • EMI SF-PC5500 thic:0.6~0.8mils

    Cu + adhesive thic:2.4mils

    Blind vias

    • Copper windowing
    • Laser via
    • Copper plating
    • Coverlay/Soldermask
    • Fab.: CNC, Laser cutting
    • Stiffener

    Flex Main Equipments

    FLEX_RIGID-FLEX

    Precision hot-Air Oven

    FLEX_RIGID-FLEX

    LDI

    FLEX_RIGID-FLEX

    Laser cutting

    FLEX_RIGID-FLEX

    Mass. Lam. For flex and cover lay

    Material Aluminum & FLEX base

    FLEX_RIGID-FLEX
    FLEX_RIGID-FLEX

    Material

    • FR4-ISOLA370HR Aluminu flex

    Capability

    Flex Capabilities
    FLEX_RIGID-FLEX-Diagram