Flex and Rigid Hybrid Board
Flex + Rigid Hybrid Board
Flexible Board
Polyimide kapton
Blind & Burried 1+FLEX+1 Laser drill
Material
- Flex:L2~L3 TU-768:L1~L0 L0~L4
- Laser:L4~L0 laser via:0.006″
- dielec tricthickness: 0.0035″~0.0045″
- No VIPPO
Construction Materials
Material Type
- PI thic:1~3mils
- Coverlay thic:2mils Ink thic:0.5~0.9mils
- Adhesive thic:1~2mils (Polyester)
- Nonflow PP 47N 49N thic:2.5mils
- Stiffener PI FR4 AL
- Copper ED RA
- EMI SF-PC5500 thic:0.6~0.8mils
- Cu + adhesive thic:2.4mils
Blind vias
- Copper windowing
- Laser via
- Copper plating
- Coverlay/Soldermask
- Fab.: CNC, Laser cutting
- Stiffener
Flex Main Equipments
Precision hot-Air Oven
LDI
Laser cutting
Mass. Lam. For flex and cover lay
Material Aluminum & FLEX base
Material
FR4-ISOLA370HR Aluminu flex
Capability
